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InselIS400

  • Manufactured with high industry standards
  • Hergestellt in professioneller Qualität
  • Designed and fabricated by expert engineers
  • Mehr als 10 Jahre Isola IS400 manufacturing experience

What's the standard features for IS400?

1.The common thickness we can offer is 2 to 93 mil (0.05 to 2.4 mm)
2.Available in full size sheet or panel form
3.½ to 2 oz (18 to 70 µm) available
4.RoHS Compliant standard
5.UL File Number: E41625

the-standard-features-for-IS400
the-typical-value-for-Isola-IS400

What is the typical value for Isola IS400?

The Glass Transition Temperature (Tg) by DSC is 150°, the decomposition Temperature (Td) by TGA @ 5% weight loss is 330°.

The comparative Tracking Index (CTI) is 175-249. When your design is automotive and transportation industry, Isola IS400 is suitable for the industry due to its high thermal resistance.

What is the advantage when choosing IS400 over Rogers material?

1. It is susceptible to maintain the overall strength of the connection of the circuit even when you expose it to high temperature.

2. As an outcome of reduced brittleness, its processing efficiency is greatly improved.

3.The resin system has a long life span, and as a result, extends the overall like of an Isolierte Leiterplatte

Venture is an authorized manufacturer and supplier of high-quality Isola IS400 in China for over 10 years now! Our Isola IS400 comes with more advanced features such as high thermal performance. It is also fabricated with high CAF resistance and Low CTE in the Z-axis.

Venture Isola IS400 is manufactured with core material standard availability. Our Isola IS400 is also available in panel form or full-size sheet. Venture always makes sure to manufacture Isola IS400 that will suit your PCB requirements!

Ihr führender Isola IS400-Lieferant in China

Venture Isola IS400 is a temperature-resistant, proprietary resin system with up to  150°C TG. Our Isola IS400 prepreg and laminates are manufactured through advanced technologies and electrical grade glass fabric. Venture Isola IS400 can deliver a low Z-axis expansion and up to 330°C  decomposition temperature.

Our Isola IS400 comes with more advanced features such as high thermal performance. It is also fabricated with high CAF resistance and Low CTE in the Z-axis.

Aside from that, Venture Isola IS400 is manufactured with copper foil type. It typically includes standard HTE grade 3 and a reverse treat foil.

Venture Isola IS400 is manufactured with core material standard availability. Our Isola IS400 is also available in panel form or full-size sheet.

Moreover, Venture manufacture Isola IS400 with different copper weights. You can choose from our 2, 1, and 1/2 oz. We can also incorporate heavier and thinner copper upon your request.

Furthermore, our Isola IS400 comes with different certifications and industry approvals. Venture Isola IS400 is a RoHS-konform. These are also IPC and UL approved.

If you are an electrical engineer, retailer, or distributor looking for a high-quality Isola IS400 laminates, choose Venture as your professional manufacturer!

Venture has more than 10 years of experience in the manufacturing Isola IS400. Throughout the years, we continuously provide excellent and great customer service.

We offer top-quality Isola IS400 that will surely suit all your PCB needs. We guarantee to give you the best service such as competitive price and flexible payment terms without minimum order required. Whether you have a large-scale or small quantity of Isola IS400 orders, you are always welcome at Venture!

Our professional customer service team and personnel are always ready to serve you! If you have inquiries about our Isola IS400, contact us directly. Expect replies within two hours!

Get an instant quote for your next Isola IS400 orders!

Isola IS400: Der ultimative FAQ-Leitfaden

Isola-IS400-The-Ultimate-FAQs-Guide

In this guide, you will find all information you need about Isola IS400 material.

So, if you have any question about Isola-PCB-Material, you will find everything here – keep reading.

Was ist Isola IS400?

IS400 is an Isola laminate and prepreg designed for mehrschichtige Leiterplatte applications that require high reliability and demanding thermal performance.

Isolierte Leiterplatte

 Isolierte Leiterplatte

This type of Isola material applies proprietary technology and has E-glass fiberglass fabric.

It features a low Z-direction expansion and decomposition temperature of 330 degrees Celsius.

What are the Features of Isola IS400 Laminate and Prepreg?

The key properties of Isola IS400 include:

  • Has a Glass Transition Temperature of 150 degrees Celsius
  • Laminate come as panel full-size sheet with thickness ranging from 0.05 to 2.4 mm
  • Uses RTF or HTE Grade 3 Copper Foil
  • Prepreg come as panel or roll
  • Uses E-glass fiberglass fabric
  • Has a dielectric constant of 3.90 and a Dissipation factor of 0.022

What are the Applications of Isola IS400?

This type of high-performance Isola laminate and prepreg materials mainly finds use in automotive and transportation industry.

Isola IS400 is suitable for this industry due to its high thermal resistance.

What is the Type of Resin System Used in Isola IS400?

IS400 uses epoxy resin systems, which have modestly low material costs and ensure a variety of formulation variations.

The glass transition temperature of epoxy resins spans from 110 to 170 degrees Celsius.

Moreover, this resin system type is compatible with majority of processes of Isola PCB fabrication.

How Do you Enhance Copper Bond in Isola IS400?

The main reasons for copper bond failure in Isola-Laminate are oxidation below the foil and thermo-mechanically produced shear.

There are several copper treatments that both minimize the impacts of secondary oxidation attack and enhance bond.

You treat the copper foil by growing copper nodules which give bonding “tooth” besides the usual grain structure.

To reduce successive oxidation attack, manufacturers lightly oxide the nodules and subsequently treat them using brass or zinc.

At times they use nickel together with chromate conversion treatments and supplementary oxidation inhibitors.

Do Resin Systems of IS400 Need Post-cure After Lamination?

Post-cure refers to an off-line cure inside an oven instead of a lamination press.

Alternatively, it can as well be a second temperature procedure within a curing process.

Most epoxy resin systems for Isola IS400 need heat curing at minimal temperatures of 100 degrees Celsius.

However, it is advisable to perform post-curing at 150 degrees Celsius for maximum heat resistance.

What are the Advantages of HTE Copper Foil in Isola IS400?

HTE is short form for “High-Temperature Elongation” copper.

This type of copper foil features a higher nominal elongation at raised temperature compared to conventional electrodeposited (ED) copper foil.

The high nominal elongation implies decreased inner layer cracking at Isola laminate interfaces when in the course of thermal cycling.

The utilization of HTE copper foil is mainly crucial in thicker epoxy circuit boards that may encounter serious Z-axis expansion.

Most PCB manufacturers use HTE copper foil exclusively due to its negligible disadvantages.

The copper foil type guarantees PCB reliability irrespective of the type of resin system you use.

Isolierte Leiterplatte

Isolierte Leiterplatte

Which are the Different Types of Fiberglass Fabric Styles Used in ISola IS400?

Manufacturing of Isola IS400 laminate and prepreg uses a variety of fiberglass fabric styles.

The choice of glass fabric style to use depends on the resin amount it can hold for bonding and filling.

Moreover, selection also relies on how the fabric style will influence the thickness of finished Isola laminate or PCB.

However, specific options mostly rely not only on laminate thickness but as well on secondary features including:

  • Dielektrizitätskonstante
  • Dimensionsstabilität
  • Steifheit
  • CTE Control
  • Kosten

Here are the most common fiberglass fabric styles for Isola Laminates:

  • 104
  • 106
  • 1080
  • 2116
  • 2313
  • 7628

Lightweight fabrics having high resin contents incline to provide smooth, resin-rich laminate surfaces. Furthermore, they ensure superior fill for inner copper etched patterns.

Conversely, heavier fiberglass fabric offers improved dimensional stability and facilitate construction of thicker IS400 laminates at reduced cost.

Using heavier fabrics, particularly 7628, can impact on the drilling characteristics and surface smoothness.

Furthermore, heavy fabrics sometimes employed in Isola IS400 to reduce costs may deflect or break small drills.

What is the Difference Between S-glass And E-glass fabric of Isola IS400?

Accurately denoted as S2-Glass, S-Glass refers to a high strength fiberglass originally created for the structural sector.

This type of fiberglass used in Isola IS400 is different from E-Glass both in properties and composition.

In terms of composition, S-Glass constitutes greater percentage of Aluminum Oxide and Silicon Dioxide compared to E-Glass.

Manufacturing it is more difficult than E-Glass since it needs special tooling during drawing procedure and features a higher melting point.

S2-Glass features a lower dissipation factor and dielectric constant than E-Glass due to the greater silicon dioxide percentage.

Moreover, this type of fiberglass as well has a modestly lower CTE in comparison to E-Glass.

However, you can put finishes on S-Glass similar to E-Glass.

This implies that it is compatible with all types of resin systems for Isola IS400.

Therefore, you should use S2-Glass when you require incremental enhancement in CTE and/or dielectric constant.

Why is the Flow of Important During Lamination of Isola IS400?

The resin system melts and flows when you heat IS400 prepreg under pressure.

Both the heatup rate of resin and pressure affect the flow amount that takes place.

There is limited duration of time through which the resin system stays fluid adequately to flow freely.

The resin gels after this period, which is the basic concept of the lamination process.

Therefore, flow represents a semi-quantitative analysis of how the Isola IS400 resin melts and flows in the lamination operation.

Actual resin flow is important to the process of lamination and laminating conditions can significantly affect it.

The level of actual flow attained will affect properties such as:

  • Laminate bond to copper foil
  • Bond to oxided internal layer copper foil
  • Interlaminar bond
  • General efficiency of Isola IS400 prepreg

Therefore, you must have constant flow properties if you are to guarantee repeatable fabrication performance.

How do you Ensure that Isola IS400 Prepreg meets its Shelf-Life?

Isola Printed Circuit Board

 Isola Printed Circuit Board

Shelf life refers to the duration it is possible to store IS400 prepreg under specific humidity and temperature environment before it ages.

After aging, the prepreg cannot flow and laminate appropriately.

You should not store the Isola prepreg in a catalytic environment like excessive radiation or UV light.

Also, before use, allow the prepreg to equilibrate at production conditions.

Moreover, it is advisable to retest the Isola IS400 prepreg for flow after first storage duration.

This helps you note and compensate for any changes.

You can apply process modifications (adjustments in pressure, heat-up rate, etc.) to tune for small changes which take place.

Consider the prepreg to have surpassed shelf life once the initial flow value has reduced by over 15% of initial value.

Any decision to utilize such kind of material should rely on real in-use tests.

There are scenarios where use of older prepreg has shown success.

Nevertheless, it involves some risk so you should make such a decision on a fact basis.

Does Construction of Isola IS400 Affect its Dimensional Stability?

The construction of IS400 laminate influences its extent of nominal movement after-etch.

It also affects movement consistency from panel to panel.

The construction that uses entirely lightweight fiberglass like 1080 will exhibit greater resin content and higher absolute shrinkage amount when cured.

Isola IS400 constructions having at least one heavier glass ply are more consistent and stable.

Hence, a 5 mil laminate consisting of two 106 and 2312 glass plies is steadier than similar laminate having two 1080 plies.

In addition, utilizing heavier plies within the prepreg layers equally assist in stabilizing the system.

Moreover, unbalanced laminate constructions, though pose potential risk because of warpage, considerably enhance inner layer dimensional stability in Isola PCBs.

How do you test the Thermal Conductivity of Isola IS400 laminate?

There are a number of methods of measuring thermal conductivity of Isola laminate materials.

However, most PCB manufacturers employ the ASTM E-4161-01 method utilizing a Laser MicroFlash device.

In this method, you irradiate the Isola IS400 sample with a single pulse of laser beam.

An infrared detector measures the rise in temperature on the opposite edge of the laminate.

You then derive the thermal conductivity from the specific heat, thermal diffusivity, and bulk density of the laminate applying the formula:

  • K = (a)(p)(Cp) where
  • K denotes the thermal conductivity (W/m-K)
  • p (rho) stands for the bulk density of the laminate (g/cc)
  • Cp is the material’s Specific Heat (cal/g)

You derive the diffusivity value from one of the various standard mathematical models out of the data generated.

Moreover, it is also possible to measure thermal conductivity effects on an actual Isola PCB using thermography.

In thermography, an infrared camera determines the temperature at several spots on IS400 laminate.

It then produces a “thermogram” that displays by different colors manner of heat distribution through the laminate at steady-state working conditions.

What is the Importance of DSC Testing of ISola IS400 Laminate and Prepreg?

Isolierte Leiterplatte

Isolierte Leiterplatte

DSC is an abbreviation for Differential Scanning Calorimetry.

It makes part of the thermo-analytical methods used to assess various chemical and physical features of laminates and prepregs.

It measures heat flow change via a resin system in comparison to that via an aluminum reference.

To establish the transition point, you heat the Isola IS400 from room temperature to a spot adequately above the required Tg.

The heating of sample in DSC happens at controlled rates.

Most physical changes and chemical reactions lead to release or absorption of thermal energy as they happen.

Endotherm refers to when a material absorbs heat, while exothermal is when a material release heat.

By measuring the endotherms and exotherms occurrence, the DSC evaluates the physical and chemical changes happening in the laminate.

DSC can give a lot of data regarding the resin system of the Isola IS400 material.

In addition, you can know the following details from the DSC:

  • The melting point of the resin system
  • Duration and temperature at which cure starts
  • The extend of the IS400 prepreg aging
  • Cure difference between B-stage and C-stage layers in multiple layer Isola PCBs (Dual Tg values).
  • The extent of laminate cure. Usually, you test this by casting two passes on the laminate. A higher Tg by the second pass compared to the first one is an indication of under-cure.

Additionally, the DSC equally can evaluate the glass transition temperature of epoxy resin system of the IS400.

It establishes the changes in energy-related to a modification in the relation between amorphous and crystalline sections within the polymer.

Why is Thermo-Gravimetric Analysis Important in Isola IS400?

TGA evaluates weight loss in relation to temperature as you heat Isola IS400.

The heating takes place either in a regulated heat up ramp or an isothermal mode.

The TGA device feature a sensitive microbalance having a precision regulated furnace.

Several changes in weight take place as you heat the Isola PCB material.

It is these changes that you measure and register as a function of temperature or time.

Some of the properties of Isola IS400 laminate you can learn from TGA include:

  • Quantity of moisture in the PCB material, which will be eliminated at 100 degrees Celsius.
  • Gross volatiles within the laminate (to some designated temperature).
  • Temperatur der thermischen Zersetzung (Td)
  • Thermal decomposition rate.
  • Ash remnants after burning off everything.
  • Arrhenius plots to help in predicting long-term thermal stability.
  • Structure interpretation from the type of gasses released by observing weight loss at distinct temperatures.

What is the Difference Between DSC and TMA Test in Isola IS400?

DSC analyzes heat flow changes in an IS400 laminate. It can sense “exotherms” when the material gives off heat, for instance during cure.

The test can as well detect “endotherms” when the Isola laminate absorbs heat like in IS400 prepreg melting.

This transition is what you refer to the glass transition temperature of PCB material.

Majority of epoxies have definite and noticeable crystalline transitions that you can easily measure by DSC.

Conversely, TMA determines dimensional changes in Isola IS400 material as you heat it from room temperature to a designated temperature.

The adjustment in length (height, or width) with temperature change represents the Coefficient of Thermal Expansion (CTE) of Isola laminate.

A quick rate of adjustment in thermal expansion happens as the temperature of test goes past the Tg.

This is because of rise in volume of free molecules.

Therefore, TMA mainly helps in measuring the CTE of IS400 laminate.

Since the CTE shifts at the Tg, you can as well establish Tg using TMA.

Here are the primary uses of TMA:

  • Measuring the X, Y and Z Coefficient of Thermal Expansion of the Isola laminate.
  • Establishing Z-axis CTE from room temperature to 260 degrees Celsius.
  • Determining the glass transition temperature of finished Isola IS400 laminates and multilayers PCBs. This helps in establishing whether you have achieved complete and satisfactory cure.
  • Modeling of solder float stability, like T260, T288 or T300 testing. In the tests, you ramp the laminate to test temperature and maintain for a preset minimum time or isothermally till failure.

The tests establishes micro-delamination or micro-cracking within the resin structure before you can observe appearance of blisters or measling visually.

How Do you Test Flow of Isola IS400 Prepreg System?

There are a number of methods for testing the flow of IS400 prepreg including:

· Dynamic Mechanical Spectroscopy

The technique is under study as a means of characterizing PCB prepreg.

It entails an oscillating disc rheometer (ODR) able to measure storage modulus and loss of Isola materials.

ODR offers a lot of information about the resin system viscosity change during melting and flow.

The presence of fiberglass fabric reinforcement obscures the resin system dynamics.

Therefore, utilizing ODR on neat resin taken from prepreg might partly overcome this challenge.

·  Dielectric Spectroscopy

This test measures the alteration in dielectric features during melting, flow and cure of Isola IS400 resin system.

However, there is no precise connection between this measurement and the resin rheology.

Moreover, impurities or ionic conductivity may as well skew this technique.

Also, the device is comparatively expensive and test techniques are very lengthy for real-time testing when manufacturing Isola IS400 prepreg.

For that matter, PCB laminate manufacturers use a modification of dielectric spectroscopy during actual lamination.

It helps in determining the moment to exert pressure during stepped pressure cycles.

· Dynamic Scaled Flow/Parallel Plate Rheometry

Parallel plate rheometry is an add-on to the standard thermal analyzer, which is clearly different from ODR.

The device is instrumental in learning vital information about resin rheology.

The technique, just like in ODR, entails sandwiching a pressed resin pellet between parallel plates.

You heat the plates at constant rate and low pressure.

The rate of closing of the plates during resin melting gives information about relative viscosity, melting point and gel time.

However, the test device is very expensive.

In addition, this method of testing IS400 prepreg flow is an unrealistic real-time operation control test.

· Oscillating Disc Rheometry (ODR)

ODR is the most popular method of characterizing resin flows.

It is the most scientific and precise means of the testing flow of Isola IS400 prepreg.

Similar to the dynamic scaled flow, it usually analyzes the resin system separate from the fiberglass fabric.

Therefore, fabric geometry factors cannot skew its results.

Does Isola IS400 Require Plasma Etching?

Typically, IS400 does not need plasma etching.

When available, you can use plasma with or without permanganate pass and plasma readily eliminates IS400 resin.

Plasma etching incline to enhance general hole quality, especially in high aspect ratio or thick Isola PCBs.

Ordinary plasma gas blends and cycles meant for traditional FR-4 epoxy resins are satisfactory.

It is advisable to follow the process of plasma etching with a chemical process instead of plasma alone.

This helps in increasing hole wall texture and eliminating plasma ash remnants.

Are there Quality Certifications for Isola IS400?

Yes, here are some of the important quality certifications that Isola IS400 laminate and prepreg should have:

Mehrschichtige Isola-Leiterplatte

 Mehrschichtige Isola-Leiterplatte

  • REACH-Zertifizierung
  • UL-Zertifizierung
  • CE-Zertifizierung
  • BSI Certification
  • RoHS Zertifizierung

How do you Image and Etch Isola IS400?

It is possible to image IS400 laminates utilizing conventional aqueous dry films.

Also, these types of Isola laminates are compatible with ammonia and cupric chloride etchants.

Depending on your unique specifications are requirements, venture Electronics offers a range of Isola PCB materials.

Kontaktieren Sie uns jetzt for all your Isola IS400 PCB materials.

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