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  • Certified with various industry standards
  • Hergestellt in professioneller Qualität
  • Fabricated in our advanced production facilities
  • Excellent after-sales service and tech support

Are there quality certification for Isola FR408HR?

Yes, there is quality certification for FR408 laminate.

Siehe unten:
1. REACH-Zertifizierung
2. UL-Zertifizierung
3. CE-Zertifizierung
4. BSI-Zertifizierung
5. RoHS-Zertifizierung


Is Isola FR408HR RoHS Compliant?

This means that the material complys with the requirements of the Directive (EU) 2015/863 on the Restriction of the use of certain Hazardous Substances in Electronics and Electronic Equipment.

In conclusion, this is friendly-environmental/RoHS-konform to the electronics industry with regard to occupational exposure during Isola-Laminat production and recycling.

Can FR408HR support Lead free assembly?

Yes, FR408HR material can support with lead free assembly. FR408HR can withstand the high temperatures of soldering and reflow in lead-free assembly process.

Es erfüllt die Charakterisierungsspezifikationen für bleifreie Montage.

Es erfüllt auch die neueren Anforderungen der bleifreien Montage.

Daher garantiert es die gute Leistung im gesamten Bereich höherer Temperaturen des bleifreien Lötens.


Venture specializes in manufacturing high-quality Isola FR408HR. We are a Chinese manufacturer offering top-quality Isola FR408HR with advanced features for more than 10 years. Our Isola FR408HR features more performance attributes like:

  • CAF-Beständigkeit
  • Lead-free assemble compatible
  • 6x 288°C solder float capable
  • 6x 260°C reflow capable
  • 0.8 mm pitch capable

Your Leading Isola FR408HR Supplier in China

Venture is a famous manufacturer of Isola FR408HR in China. Our Isola FR408HR is a high-performance prepreg and laminate. These are a proprietary  230°C (DMA) high-performance glass transition temperature.

Our Isola FR408HR is manufactured from a multifunctional high-performance resin system. These are also reinforced with materials like electrical grade glass fabric.

We manufacture Isola FR408HR that can deliver up to 30% of z-expansion improvements. It can also offer a 25% increased electrical bandwidth.

Aside from that, our Isola FR408HR is equipped with superior moisture resistance. This property helps in bridging the gap both from an electrical and thermal perspective.

Venture Isola FR408HR is also UV blocking and laser fluorescing for an AOI maximum compatibility. It is also compatible with photo-imageable solder mask imaging and optical positioning system.

We manufacture top-quality Isola FR408HR with advanced features. Our Isola FR408HR features more performance attributes like:

  • CAF-Beständigkeit
  • Lead-free assemble compatible
  • 6x 288°C solder float capable
  • 6x 260°C reflow capable
  • 0.8 mm pitch capable

Isola FR408HR: The Ultimate FAQs Guide


If you’re looking for any information about Isola FR408HR, you will find it right here.

This guide has all information about these Isola PCB materials.

So, let’s dive right in if you want to learn more.

What is Isola FR40HR?

FR408HR refers to a proprietary high-performance FR-4laminate and prepreg system.

Sie sind geeignet für Mehrschichtleiterplatten where you need maximum reliability and thermal performance.



The material incorporates Insel’s copyrighted high-performance multifunctional epoxy resin system strengthened with E-glass fabric.

These features together with superior moisture resistance, creates a product that closes the void from both an electrical and thermal aspect.

What are the Features of Isola FR408HR?

These are the typical characteristics of Isola FR408HR laminate and prepreg:

  • Laminate come as full size panel or sheet
  • Uses mechanically spread or square weave E-glass fiberglass fabric
  • Has a Glass Transition Temperature (Tg) of 230 degrees Celsius
  • Prepreg come in the form of panel or roll
  • Employs HTE Grade 3, VLP-2 and RTF copper foil

Which are the Important Mechanical Properties of Isola FR408HR that you Must Consider?

Here are the key mechanical features of FR408HR that you need to consider:

Isolierte Leiterplatte

Isolierte Leiterplatte

· Schälfestigkeit

Peel strength measures the strength of bond between the FR408HR material and the copper conductor.

You express it in average load/conductor width or force per linear inch (PLI) needed for separating bonded materials.

The angle of separation should be 180 degrees, with the peel strength test finalized under three conditions:

  • After thermal stress where you float the FR408HR laminate on solder for 10 seconds at 288 degrees Celsius
  • At elevated temperatures where you expose the Isola material to hot fluid or air at 125 degrees Celsius.
  • After process chemicals exposure where you subject the product to a sequence of procedures in a thermal or chemical process

The peel strength of Isola FR408HR is 5.5 lb/inch after thermal stress and 5.1 lb/inch after process solutions.

· Biegefestigkeit

Flexural strength determines the capacity of FR408HR capacity to endure mechanical stress without breaking.

Flexural bending strength test typically involves supporting the Isola material at its edges and then applying load at the center.

IPC-4101 is the Standard for PCB laminates.

It stipulates the required least flexural strength of different circuit board materials.

Therefore, flexural strength of Isola FR408HR is 72.5 ksi in length direction and 58.0 ksi in cross direction.

· Elastizitätsmodul

Also known as tensile modulus, Young’s modulus equally determines the FR408HR strength.

However, it evaluates the strain/stress ratio in a specific direction, and its measurement unit is also force/unit area.

Some PCB laminate fabricators express material strength as Young’s modulus and not flexural strength.

For that reason, the Young’s modulus of FR408HR laminate is 3695 ksi along length direction and 3315 ksi along cross direction.

· Dichte

Typically, you express the density of PCB laminate in pounds/cubic inch or grams/cubic centimeter.

· Time to Delamination

Time to delamination establishes the length of time a PCB material will take to resist delamination.

Delamination refers to the separation of the resin from the foil, fiberglass, or laminate at a specific temperature.

Some of the causes of delamination include wrong material Tg, thermal shock, moisture and poor process of lamination.

The time to delamination of Isola FR408HR is 60 minutes at T260 and great than 30 minutes at T288.

What are the Advantages of Isola FR408HR?

The main benefits of FR408HR laminate and prepreg system include:

1) High Thermal Performance

  • Has high Glass Transition Temperature (Tg) of 190 degrees Celsius
  • High Decomposition Temperature (Td) of 360 degrees Celsius as determined by TGA at 5 percent weight loss.
  • Low Coefficient of Thermal expansion (CTE) for reliability

2) AOI Fluorescence and UV Blocking

The FR408HR system is as well UV blocking and laser fluorescing.

This guarantees maximal compatibility with optical positioning systems, Automated Optical inspection (AOI) systems, and photo-imagable solder mask imaging.

Due to this fact, it ensures high accuracy and throughput during construction and assembly of Isola FR408HR PCB.

3) Superior Processing

Closest to traditional FR-4 processing of most high speed Isola laminates.

4) Enhanced Z-axis Expansion and Lower Loss

This Isola laminate and prepreg system provides a 30 percent advancement in Z-direction expansion.

Moreover, it also delivers lower loss (25 percent more electrical bandwidth) in comparison to rival products in its class.

The other advantages of Isola FR408HR are:

  • Kompatibilität mit bleifreier Montage
  • CAF resistant
  • Multiple lamination cycles
  • Via filling capability

What are the Applications of Isola FR408HR Laminate?

Uses of FR408HR are common in the following fields:

  • Medizinische Industrie
  • Luftfahrt und Verteidigung
  • Communication and Networking industry
  • Computer, Speicher und Peripheriegeräte
  • Industrie und Instrumentierung

What is the Main Advantage of using VLP-2 Copper Foil in FR408HR?

Very Low Profile copper minimizes variation in dielectric constant.

It ensure this through laminate processing by facilitating uniform construction.

For this reason, using VLP-2 foil in Isola FR408HR guarantees superior impedance control.

How Does Heat Ramp Affect the Lamination Process of Isola FR408HR?

Isolierte Leiterplatte

Isolierte Leiterplatte

Faster heat ramps decreases the minimum attained viscosity and enhance fill and flow of resin.

However, it makes the FR408HR to take less time within the flow window.

This causes a stricter process window and has a high probability of leading to glass lock/glass stop conditions.

A lamination cycle entailing an isotherm hold is not advisable for quicker heat ramps.

Though slower heat ramps don’t attain similar relative viscosity, it allows the laminate to take more time within the flow window.

As a result it creates a broader process window.

Moreover, slower heat ramps perform excellently with isotherm lamination cycles.

What is the Purpose of Desmear Process in FR408HR?

The primary role of desmear processing on Isola FR408HR is to eliminate debris and give the hole walls acceptable texture.

If you properly cure and drill the PCB material, it will produce very little smear.

With good quality of drilled hole, you can achieve better desmear and deposition of electroless copper.

Board design considerations, drilling conditions and resin cure influence the creation of smooth, debris-free hole walls.

To improve the overall quality of drilled hole, eliminate 7628 or equivalent heavy glasses if possible.

In addition, make sure you properly adjust drill parameters on totally cured FR408HR boards.

This assists in minimizing generation of smear, which enhances desmear performance and might ultimately aid in reducing copper wicking.

Why is Plasma Desmear the Best for Isola FR408HR?

The most preferred desmear method for high performance PCB-Materialien such as Isola FR408HR is plasma desmearing.

It allows consistent etching of resin system with high chemical resistance, and when appropriately run gives superior hole wall texturing.

You can perform it in conjunction with or without one permanganate pass.

But, you must be very careful to excessive removal of resin when you apply both plasma and permanganate.

In plasma desmearing of FR408HR, using ordinary plasma gas combinations and cycles is enough.

Employing this method of desmear guarantees improved general hole quality.

How do you handle and Store Isola FR408HR Prepreg?

Manufacturing of Isola FR408HR prepreg bonding panels for utilization in multilayer PCB applications is to specifications.

This consist of electrical properties, physical properties and processing characteristics in relation to laminating application.

Handling and storage of the prepreg have vital effects on its desired performance.

The environment you store the FR408HR prepreg affect some of its properties.

They can as well degrade over prolonged durations of storage.

The prepreg is a fiberglass fabric impregnated with a designated amount of low volatile, partly polymerized resin.

The resin system is tack-free though slightly brittle.

Most lamination issues are because of resin loss from the fabric or woven glass damage due to incorrect handling.

The fabric employed depends on the order and gives the needed thickness.

In most scenarios, the quantity of resin held by the fiberglass fabric increases as the thickness of the fabric increase.

· Handling Recommendations

You should wear clean gloves when handling all Isola FR408HR prepreg.

Further, utilize sharp, precision devices if paneling or cutting Prepreg.

Moreover, assume that all prepreg are very fragile materials.

Therefore, exercise extreme care if handling prepreg with very high resin content (1080 glass fabric and finer styles).

· Storage Recommendations

Upon receipt, you must transfer all FR408HR prepreg to a controlled area.

Make sure you utilize all the prepreg as earliest as practical employing First-In-First-Out (FIFO) inventory control system.

Failure to handle correctly, the material will absorb moisture leading to depressed cure and Tg and influence flow during pressing.

In case there is need for prolonged storage, you need to reserve separate facilities having suitable environmental control.

Ensure you store the prepreg at temperature equal to or less than 23 degrees Celsius and humidity below 50 percent.

Additionally, allow the FR408HR prepreg package to equilibrate to the conditions of layup space prior to opening.

Doing so helps prevent condensation of moisture on the prepreg.

How Should you Drill Isola FR408HR?

The FR408HR materials display improved resin thermal stability and produce few or no smear.

To ensure effective resin debris removal during drilling, apply undercut drill geometries on drills having diameter up to 1.0 mm.

Furthermore, also use high helix tools.

However, in the case of multilayer or boards of greater thickness, employ peck drilling parameters.

· Chipload and Cutting Speed

In relation to ordinary FR-4 parameters, utilize lower chiploads when drilling Isola FR408HR PCBs.

Thick circuit boards having special cladding like invar or heavy copper need extra conservative drill parameters.

Also, boards having coarse glass weave or several inner layers of 2 oz. copper might equally need more conservative parameters.

High chip loads and cutting speeds always result in rough holes and cracking about the glass yarn.

· Hit Count and Stack Height

Hit counts and stack heights will differ with the general thickness and construction of the board you are drilling.

Drill one high for boards having general thickness above 2.5 mm, having high layer counts.

Utilize undercut bits for specifically demanding designs.

Lubricated backing and aluminum entry assist in producing hole walls of good quality though are not crucial in all applications.

Can you Use Solvent Swellers in Chemical Desmear of Isola FR408HR?

Trials have shown that Isola-LaminatFR408HR has high chemical resistance compared to ordinary FR-4 resin systems.

Solvent swellers absorption leads to crazing or cracking of fiberglass between holes.

For that matter, you should run chemical desmear without solvent swellers.

However, if not compatible, you can use alkaline butyl carbitolswellers since they have least effect.

Additionally, NMP chemistries are usually aggressive and may cause reliability problems coupled with cracking noted above, following lead-free thermal stress.

Therefore, you should refrain from using NMP swellers. Use of NMP swellers is strongly discouraged.

Why is Copper Anodic Filament (CAF0 Resistance an Important Feature of Isola FR408HR?

Growth of CAF between neighboring plated thru-holes can lead to intermittent performance and shorts in FR408HR PCBs.

This occurs when consistent voltage differential between thru-holes, physical pathway and ionic residues promote electromigrated copper deposition across a glass fiber.

CAF is specifically an important consideration when manufacturing large high-performance FR408HR PCBs that will be in continuous use.

CAF problems have relation with material choices as well as board fabrication.

However, optimized processing, engineered glass finish, and correct resin formulation can enhance resistance to formation of CAF.

What is the Benefit of Copper-Invar-Copper in Isola FR408HR?



Copper-Invar-Copper refers an invar sandwich, a nickel constituting iron alloy, adhered between two copper layers.

The rolling process metallurgically bonds invar, which helps in reducing the thickness of FR408HR laminate to approximately 0.006″.

Normally, the copper to invar ratio is 12.5 percent/75 percent/12.5 percent, which results in a CTE of approximately 5.5 ppm/°C.

Due to the high modulus of CIC, it is efficient in restricting the general movement of PCB.

Therefore, you can use CIC as restraining and ground layer and heat sink in Isola FR408HR multilayer PCB for SMT applications.

Which are the Crucial Process Parameters that you Must Ensure During Isola FR408HR Lamination?

There exist 5 distinct areas that you must consider during stack up and lamination process of FR408HR.

The parameters include the following:

  1. Maintaining processed inner layers and FR408HR prepreg dry before lamination.
  2. Regulation of heat up rate within the laminating press to make sure there is consistent melt flow.
  3. Ensuring there is right lamination temperature for the FR408HR you are using.
  4. Making sure that the cure time is sufficient to develop glass transition temperature.
  5. Regulierung der Abkühlung zur Vermeidung von Verzug.

Why is Vacuum Lamination Better than Conventional Lamination for Isola FR408HR?

Vacuum lamination is currently the favorite of most PCB manufacturers.

For several reasons, this method of PCB lamination is exceptionally desirable.

Both autoclave systems and enclosed vacuum presses are in application.

However, the greatest dissimilarity is that autoclave systems exhibit slower heat up rate.

Therefore, you should use FR408HR prepregs having adequate resin content capable of flowing and filling at lower heat rate. This ensures higher melt viscosity.

Moreover, it is possible to apply reduced lamination pressure in any kind of vacuum lamination system.

This is due to the fact that the vacuum itself aids with resin flow into holes and around traces.

The reduced pressure as well assists with registration, particularly in complex Isola FR408HR PCBs.

What Dictates the Weight and Type of Copper Foil Used in Isola FR408HR Laminate?

The copper foil utilized in boards made using FR408HR material has various roles.

The main function is it serves as a circuitry line for carrying signals to enable interlinking of several board components.

Copper as well functions as ground and power layers.

Moreover, they can also conduct unnecessary heat out of power devices.

For that reason, you must determine various properties of your FR408HR PCB.

It is these characteristics that dictate the thickness and type of copper to utilize:

  • Power handling specifications of the circuit board, since thin copper will not manage as much current as thicker copper.

Routing of excess power across a small cross section can lead to overheating and burnout.

  • The area of cross section of the copper foil utilized influence line loss and characteristic impedance.

Further, the dielectric constant and thickness of FR408HR laminate also affect line loss and characteristic impedance.

Therefore, you need to factor these in during design calculations.

  • The spacing and size of copper traces that you must etch on the several layers.

Narrow spacing and very fine lines will typically need DSTF foil or thinner copper to reduce undercut when drilling.

  • Heat dissipation the copper is to handle, particularly in internal layers. Heavier copper foil has the capacity to dissipate more heat.
  • Other factors like internal layer bonding, among others may need special copper features and finishes.

How Does Moisture Affect the Performance of Isola FR408HR?

With most multifunctional epoxy resin systems, moisture reacts (hydrolysis) with the resin thus reducing the Tg.

Technically, moisture does not decrease the Tg of Isola FR408HR or meddle with crosslink density.

However, it can impede the product and press from attaining the required temperature profile and cure time.

This ultimately can constrain the proper development of Tg.

Moreover, moisture can lead to extra issues in finished Isola FR408HR PCBs.

Excessive moisture can compromise the integrity of multilayer PCB under high temperature strained conditions.

Therefore, it is essential to control moisture levels even in completed bare boards before solder reflow or PCB assembly processing.

So, it is advisable to vacuum dry FR408HR prepregs for a specific duration at 29″ of Hg.

It is preferable to use vacuum desiccation under room temperature instead of any type of oven drying.

This is because oven drying can advance the prepreg, resulting in insufficient or marginal bond or flow.

The outcome of insufficient bond or flow is delamination or extra failures on succeeding thermal processing.

Which are some of the Precaution you should Ensure when dealing with High-performance Resin used in FR408HR Prepreg?

The basic process of fabricating multilayer FR408HR PCBs and majority of other high-performance resin is similar to FR-4 prepreg.

The dissimilarities lie in the specific characteristics of high-performance resin systems which differ from those of traditional epoxies.

There are various aspects in which you need to apply different procedures or special precautions when handling FR408HR prepreg:

  • Majority of multifunctional epoxy prepregs have very high moisture sensitivity than standard FR-4 prepregs.

For this reason, they need special drying and/or handling.

  • Traditional black oxide treatment of internal layer copper won’t often provide a better even bond with FR408HR resin.

Instead, utilize a reduced oxide or even a brown oxide.

Though black oxide treatment gives an aesthetic dense black appearance, it is unworthy of the risk of delamination and blistering.

  • You must customize the lamination cycles to the higher melt viscosity and melting temperature of the resin system.
  • In special circumstances like low dielectric constant resin systems, the cure mechanism is different and flow is lower than usual.

Therefore, employ lower heat-up rate to ensure sufficient flow before cure.

  • When employing traditional FR-4 processing.

You cannot realize superior etch back on FR408HR with conventional concentrated sulfuric acid that performs excellently with low Tg FR-4.

Instead, use good alkaline permanganate or plasma for high-performance prepreg systems.

In short, there are many factors you should consider before choosing Isola FR408HR material.

Das Beste daran ist, dass dieser Leitfaden alles enthält, was Sie wissen müssen.

Falls Sie Fragen oder Anfragen haben, zögern Sie nicht Wenden Sie sich an das Venture Electronics-Team.

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