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Fine-Pitch Elektronische Baugruppe

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Used to test the four-terminal sensing of fine-pitch Electronic Assembly

Fine-pitch PCB components are used in high density applications where circuit performance and precision are required, often in automotive and medical applications. According to IPC 9252, PCBA used in these fields should have four terminal Kelvin sensing.

Fumax’s four terminals sense the fine-pitch PCBA with an accuracy of ±0.1m ω and inspect 2,000 to 32,000 test points at a time.

If you want reliable and cost-effective fine-pitch PCB assembly service, Venture Electronics is the smart choice for you!

Used to test the four-terminal sensing of fine-pitch Electronic Assembly
2-The choice of solder paste has a significant impact on Fine-pitch Electronic Assembly

The choice of solder paste has a significant impact on Fine-pitch Electronic Assembly

With the development of electronic products to the direction of short, small, light, thin, triggered packaging devices to smaller, thinner, faster, more convenient and more reliable structure trend change. In this market trend, 01005 devices smaller than 0201 devices and 0.35MM chip spacing are being popularized and applied, which means SMT-Bestückung will be much more difficult.

The refinement of pad size and spacing will make solder paste solder and welding difficulty significantly increased, solder paste selection also has a significant impact on fine spacing electronic assembly.

Venture team has professional engineers to control the purchase and use of solder paste. You are welcome to send a quotation to test our service and quality.

Fine-Pitch Electronic Assembly Welding defect analysis and process optimization

Fine-Pitch Electronic Assembly has excellent electrical performance. However, the defect rate is quite high when a PCB welds multiple fine-pitch devices. In the welding process of aerospace products with high reliability requirements, the number of device repair is limited, and the repair will cause the degradation of device performance, component reliability and other problems.

Therefore,Venture engineers analyze and optimize products from the technologic design of pads, Stahlgitter template design, welding temperature curve design and other aspects. After optimization, the yield of fine-pitch device in one assembly is improved, and there is no tin bead, virtual welding and other defects.

3-Fine-Pitch Electronic Assembly Welding defect analysis and process optimization

Venture is more than 10 years in providing fine-pitch electronic assembly services in China. We are capable of providing quality fine-pitch electronic assembly as we have experienced and qualified engineers.

Venture fine-pitch electronic assembly team will work hard in order to accomplish our committed deadlines.

Along with our comprehensive capabilities, we can give you the desired output.


Your Leading Fine-Pitch Electronic Assembly Manufacturer in China

Venture fine-pitch electronic assembly can be also referred to as Leiterplatte mit hoher Dichte assembly. As a leading manufacturer, Venture offers quality fine-pitch electronic assembly services for more than 10 years.

We are capable of providing the varied needs of the clients such as:

  • Smallest components 01005, 0201, 0402.
  • Assemble 0.25mm Fine pitch parts (pitch up to 8 mils).
  • Leadless components, BGA, µBGA, LGA, package on package, etc.

As a professional fine-pitch electronic fabrication manufacturer, the Venture fine-pitch electronic assembly team take each step to ensure successful design for your PCB:

We normally offer fine-pitch PCB assembly for low quantity orders and for the Prototyp. At the same time, we are capable to cater to other quantities.

Venture delivers quality fine-pitch assembly services as we conducting numerous quality checking tools:

  • Visual assessment for standard quality test,
  • automated optical inspection (AOI) for corroboration of lifted leads
  • insufficient solder joints, etc

We also follow functional tests, x-ray inspection, In-circuit test, sample check, etc. All these methods are put to use to have an efficient fine-pitch assembly service.

Whether you are a product designer, electrical engineer, system integrator, Venture fine-pitch electronic assembly team will be your perfect fine-pitch electronic assembly house in China.

At Venture, we can answer any PCB assembly questions that you may have. Please don’t hesitate to contact us anytime.

Fine-Pitch Electronic Assembly: The Ultimate FAQ Guide


In this guide, you will learn everything you need to know about fine-pitch electronic assembly.

From basics to advanced concepts, you will find all the vital information right here.

Tauchen wir gleich ein.

What is Fine-Pitch Electronic Assembly?

Fine pitch electronic assembly is the process of assembling printed circuit boards distinguished by fine spacing between small leads.

In other words, you will be assembling numerous PCB-Komponenten very close together making sure there is proper spacing.

Fine Pitch Electronic PCB Assembly

Fine Pitch Electronic PCB Assembly

What are Some of the Applications of the Fine-pitch Electronics?

Here are some of the applications of the fine pitch electronics in different industries.


You will use fine pitch PCB assembly to make electronics that do not fail for the military. Such electronics need accurate precision and also durability to survive in tough environments where the military operate.

Luft-und Raumfahrtindustrie

In the aerospace industry, you will make electronics that can operate in controlling and operating space exploration equipment.

Since the aerospace is such a demanding industry, you must have fine pitch electronics fine-tuned for the purpose.


In the aviation industry, you will use fine pitch electronics to control the aeroplanes that we entrust with our lives.

You will need fine pitch electronics to fine tune all the programs and control systems of the aeroplanes and helicopters.

There are numerous other applications where you can use the fine pitch electronics to make the best of machines.

Which Processes Do You Use in the Assembly of Fine-pitch Electronics?

Well, you will use the necessary printed circuit board assembly processes in the assembly of fine pitch electronics.

In other words, you can use any of the Leiterplattenmontage process to manufacture or assemble the fine pitch electronics.

Here are the main processes that will guide you through the assembly process of fine pitch electronics.

How Does Fine-pitch Through Hole Technology Compare to Surface Mount Technology?

You can either opt for surface mount technology or through hole technology assembly processes because they are the most common.

Despite being very common in fine pitch printed circuit board assembly, they also have quite a lot of differences.

Here is a comparison between surface mount technology and through hole technologies for assembly of fine-pitch electronics.


Through hole mounting technology is the process by which you will mount component leads into drilled holes on the bare PCB. In other words, you will have to drill holes through the printed circuit board stackup and then mount the electronic components.

Despite being overtaken by surface mount technology over the recent years, you will still need through hole technology for reliability. You will use them for high reliability products even though the process is tedious, time consuming and costs more.


Surface mount technology involves securing the components right on the surface of the printed circuit board using solder materials. You do not have to drill holes through the printed circuit board stackup to mount the components thus reducing assembly cost.

Despite the fast and low cost of assembly, your final fine pitch PCB may not be as reliable and strong. You might need to conduct frequent replacements of the components especially when working in tough and extreme environmental conditions.

Figure 2 SMT vs Through-Hole Fine Pitch PCB Component Mounting Technology

 SMT vs Through-Hole Fine Pitch PCB Component Mounting Technology

What Does Fine-pitch Turnkey Electronics Assembly Involve?

Turnkey electronics assembly is the process by which your manufacturer is responsible for all the PCB assembly procedures.

In other words, all you have to do is order a complete fine pitch printed circuit board electronic from the manufacturer.

Your supplier is responsible for designing, procurement of components and parts, as well as the assembly process.

It is the best form of assembly for fine pitch electronics assembly due to easy management and saving on time.

What are the main Quality Standards for Fine-pitch Electronics?

You need to ensure that the fine pitch PCB assembly adhere to all the quality standards and requirements of the assembly process.

Here are the main quality standards or certifications that you must adhere to.

  • RoHS-Qualitätsstandards
  • CE-Qualitätsstandards
  • UL-Qualitätsstandards
  • ANSI/AHRI Quality Standards

How Do You Test the Quality of Fine-pitch Electronics?

During and after the assembly process of fine pitch electronics, you must ensure that you test the electronics.

You must test the quality of the fine pitch electronics to ensure that they are in perfect working conditions.

In this case, you might have to perform multiple tests to ascertain the fine pitch electronics working conditions.

Here are the main tests that you can perform on the fine pitch printed circuit boards to ensure proper functionality.

Visual Assessment Inspection

You will use visual assessment inspection tests to ensure that all the aspects of the fine pitch electronics are in place. You might also need to use visual aid such as cameras and your naked wyes to identify issues with the PCB.


You will use 2D and 3D AXI tests to detect defects on the printed circuit board earlier during the manufacturing process.

You will use this process to view solder connections, internal traces, and barrels during fine pitch electronics assembly process.

Automatisierte optische Inspektion

In this case, you will employ 2D and 3D cameras to automatically inspect the fine pitch printed circuit boards. After that, it will compare details on the fine pitch PCB electronics to the original schematic to check for issues.

Im Schaltungstest

You will use the in-circuit test to power up and test individual circuitry within the fine pitch electronics board.

It involves the bed-of-nails test which covers about 85 to 90% of testing accuracy that is free from human errors.

Fliegende Sondenprüfung

You will use the flying probe testing techniques to test the in-circuits of the fine pitch electronics during the assembly process.

It is a cheaper option or mode of testing that you can use to test the following PCB aspects:

  1. Open Circuit on the fine pitch PCB electronics
  2. Short Circuits on the fine pitch PCB electronics
  • Resistance of the fine pitch PCB electronics
  1. Capacitance of the fine pitch PCB electronics
  2. Inductance of the fine pitch PCB electronics
  3. Diode issues on the fine pitch PCB electronics

What is the Designing Process of the Fine-pitch Electronics?

You will need a designing software to help you include very fine pitch components on the PCB for high density applications.

Apart from the designing software, you must make sure that designer and the manufacturer are in close contact.

Implying that, fine pitch electronics are very sensitive and you have to maintain the details of the designing process.

Here is the process that you will follow when designing the fine pitch printed circuit board electronics.

Step One: Creating a Schematic

You will begin the whole process by creating the blue print or the plan or the schematic that will guide your steps.

Here, you will place every little detail that you need on the board in the right place.

Apart from that, you will also create the connections between the components on the fine pitch electronics.

After that, you will create a blank printed circuit board layout using a schematic capture tool. It is also the point where you will determine the dimensions such as shape, layer stackup, and size of the PCB.

Make sure that you review all the relevant details on the design at this point before you proceed to the next step.

Step Two: Designing Fine Pitch PCB Electronics

This is the point where you will ensure that you place all the other details you need on the fine pitch electronics.

You will deal with the connections within the fine pitch PCB stackup and use impedance profilers to control impedance.

In addition to that, you will determine the number of layers on the fine pitch PCB electronics. All through the designing process, you must make sure that you play by the designing rules and DFM requirements.

Place all the components on the design and insert the drill holes in case you are using through hole mounting technology.

Make sure that you route the traces and place all the identifiers and labels on the printed circuit boards.

Finally, you will generate all the design files and save them for review, prototype manufacturing and final production.

Fine Pitch Electronic PCB Component Mounting

 Fine Pitch Electronic PCB Component Mounting

What are Some of the Challenges Experienced with Fine Pitch PCB Layouts?

One of the most significant challenges that you may experience with fine pitch PCB layout is the designing of PCB.

You will have to deal with the placement of hundreds of components on the printed circuit board limited space.

It also involves numerous trials and errors in order to avoid the possibilities of creating unwanted pitfalls.

Apart from that, you may also go through a challenging time in spacing of the components on the printed circuit board.

What are the Considerations for Board Space Optimization in Fine Pitch Electronics?

Well, you should rest easy knowing that the numerous challenges have their solutions.

There are multiple factors that you can consider to help in board space optimization for the electronics.

Here are some of the factors you need to consider to ensure that you use the board space optimally.

Via in Pads

You can have vias in pads which will clear up considerable amount of space for traces in between tight space components.

Here, you will build vias on the pads of the components thus saving on routing space for routing.

Decoupling Capacitors

Here, you will place the fine pitch electronic components below, above and near the sensitive pins.

You have to be very careful with the mounting process and placement even though it may consume considerable space.


You will place guide markers that will help in recognizing the right place for placement of the components.

Depending on the precision pf placing the components, you might save a lot of space on the fine pitch electronic board.


You will have the tooling holes of the fine pitch electronics stack up to help in the aligning process of the board. It is the best form alignment that will also go a very long way in saving space on the fine pitch electronics.

Special Modifications

You can also make manual adjustments on the fine pitch printed circuit board by cutting out the irrelevant parts. This will help in reducing the overall weight and the large size of the fine-pitch printed circuit board.

3D Parts

You can employ powerful 3D tools in the placement process which will increase the speed and placement of components.

It will also help in improving the precision of placement while conserving enough space on the board.

How Much Does the Fine Pitch Electronics Assembly Cost?

You will spend quite a considerable amount of money in the assembly of the fine pitch electronics.

The price is not definite since most of the factors affecting the price are also not definite.

In other words, there are specific factors that will either keep the price low or drive the price up.

For instance, quality and quantity of the fine-pitch electronics will either increase or decrease the price.

An increase in quality and quantity will definitely lead to an increase in the cost of the fine pitch electronics assembly.

What are the Advantages of Using Fine Pitch Electronics?

You will use the fine pitch electronics in some of the toughest of environments in different applications.

Implying that, fine pitch electronics are very tough and durable and can survive the tough environmental conditions.

Here are the other benefits that you will enjoy when you use the fine pitch electronics.

Hohe Wirkungsgrade

You can use the fine pitch electronics in the most demanding of applications and it will perform extremely well.

Implying that, the fine pitch electronics are very efficient and will produce results in such demanding applications.

Easy Diagnostic and Repair

In case you experience problems with the fine pitch electronics, it is very easy and simple to diagnose source of problem.

As soon as you identify the problem, you will be in a better position to get the damaged components and make repairs.

Immun gegen Bewegung

You will also have great immunity to movement as the board has the flexible options which can bend easily.

This makes them very flexible and can go around bends in most of the applications thus increasing reliability.

What are the Disadvantages of Using the Fine Pitch Electronics?

Despite the numerous benefits, you may also have a number of limitations that you might experience.

Here are some of the limitations that you will experience with the fine pitch electronics.

Difficulty in Assembly Process

The process of assembling the fine pitch electronics is usually complicated and requires special attention. You must concentrate on the assembly process and use special types of machines to make it work.

High Cost of Assembly

You will also spend a lot of money in the assembly process of the fine pitch electronics due to the difficulty in assembly.

This is, however, quite relative as the price factor is affected by a number of numerous factors.

How Long Does It Take to Complete Fine Pitch Electronics Assembly?

Depending on how soon you want the fine pitch electronics, you can get it withing 24 hours to 10 days. In other words, in case you need a quick turn fine pitch electronics, you will get them within 24 to 72 hours.

You will, however, pay more for quick-turn assembly because of the high man power and machine operation to save time. You can also wait for a maximum of 10 days to receive the fine pitch electronics and pay less for them.

Figure 4 Fine Pitch PCB Assembly

 Fine Pitch PCB Assembly

How Do You Troubleshoot the Fine Pitch Electronics?

There are cases when you might be in a dilemma and not understand why the fine pitch electronics fail.

In such a case, you have to troubleshoot the fine pitch electronics and then identify the problem.

During the troubleshooting process, here are some of the things you will have a look at.

  • Inspecting the solder joints
  • Identifying the main problem though self-diagnosis of the fine pitch electronics
  • Troubleshooting particular parts on the electronics that may have the problem
  • Consulting the fine pitch electronics manual
  • Testing the functionality of the fine pitch electronics

How Do You Diagnose the Problems with the Fine Pitch Electronics?

In case you have to perform repairs on the fine pitch electronics, you must know the source of the problem.

Here are the stages that you can follow to perform proper diagnosis on the fine pitch electronics:

You can use the VI instruments to identify the source of the problem on the fine pitch electronics.

It uses alternating current voltage which will test the unidentified counts on the testing pins.

After that, the machine will identify the location of the problem on the fine pitch electronics. You can use a microscope or very sharp 3D cameras to help in identifying the source of the problem.

Are there Methods for Analyzing Results for Fine Pitch Electronics Diagnostics?

Yes, there are methods that you can employ in the analysis of the results from the diagnosis of fine pitch electronics.

Here, you will do a proper comparison between the main schematic and the faulty fine pitch electronics. Doing a proper comparison will help in identifying the part of the fine pitch electronics that is causing problems.

How Does BGA and uBGA Assembly of Fine-pitch Electronics Compare?

Under surface mount technology, you can opt for a number of assembly and packaging processes.

Ball grid array (BGA) is one of the surface mount packaging techniques that you can use for fine pitch electronic circuits. You will use ball grid array to permanently mount devices or components such as microprocessors on the bare PCBs.

Ball grid array (BGA) will provide you with more interconnection pins that you can assemble on dual in lines.

uBGA is a special type of ball grid array assembly which you will use for ultra-fine ball grid array assembly.

You will employ ultra-fine ball grid array (uBGA) assembly on double sided flex circuit boards among other complex circuits.

You will also use it to increase the physical characteristics of fine pitch electronics by reducing both size and weight.

Figure 5 Fine Pitch BGA Package

Fine Pitch BGA Package

Which Issues Would You Find on the Fine Pitch Electronics After Troubleshooting?

During the analysis stage of the fine pitch electronics, you might identify specific problems on the electronics.

Here are the main types of problems that you might come across during the troubleshooting and analysis process.

  • Faulty electronic circuits
  • Broken or loose component placements
  • Insufficient supply of the electronic currents
  • Damaged components due to high temperatures

How Do You Fix Some of the Problems You May Encounter with Fine Pitch Electronics?

Just like everything else that deteriorates over extended use and time, fine pitch electronics tend to run into problems.

You may encounter problems such as trace damages that affect conductivity, as well as component to circuit failure among other issues.

Here are some of the problems that you can encounter and how you can repair them.

Körperlicher Schaden

Most of the damages that you will encounter with the fine pitch electronics are the physical damages.

These are the damages that occur on your fine pitch printed circuit boards from physical shock and pressure.

You can remedy the physical damages on the fine pitch electronics through remanufacturing and assembly of the entire printed circuit board.

It involves melting down the part with damages, disassembly and finally assembling the printed circuit board.

Defekt eines Bauteils

Other than the physical damages, you may also go through particular problems as a result of component failure.

In many cases, when fine pitch electronics fail, the problem will be component failure if it does not have physical damages.

Here, the main remedy is using various testing tools to test the conductivity of the components and identify faulty components.

As soon as you identify the faulty component, you can proceed with removing it and replacing with a new functional component.

Are Fine Pitch Electronic Assembly Processes Safe?

Yes, fine pitch assembly processes are very safe for the operators and the environment.

It ensures that every aspect of the assembly process is in accordance to the safety and quality specifications.

In addition to that, the products that you will use are lead free and do not pollute the environment.

Can You Use Fine Pitch Electronics Under Extreme Working Conditions?

Yes, fine pitch electronics are best for such extreme working conditions.

It is strong enough and durable to withstand the pressure from the extreme working conditions.

Apart from that, the components are strongly routed within the board thus making them stick permanently.

At Venture Electronics, we will help you in all PCB assembly and PCB-Fertigungsprozess.

For any inquiries or questions, feel free to Kontaktieren Sie uns.

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