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20 Unzen Kupfer PCB

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What Is the Difference Between a Standard PCB and a 20oz Copper PCB?

20 oz copper PCB is significantly different from Standard PCB. The following comparison may help you decide which one to choose.

●It needs only 1 oz when producing a standard PCB while 20 oz Copper PCB has a copper concentration of 20 ounces each layer, which is also called schwere Kupferplatine.
●20oz copper is suitable for heavy duty than standard PCB

●20oz copper circuits conduct more current than the standard one.
●High-end applications benefit from thick copper PCBs due to their excellent thermal dissipation.
●The mechanical strength of heavy copper PCB is better than standard copper PCB.

the-Difference-Between-a-Standard-PCB-and-a-20Oz-Copper-PCB
Surface-Finish-OF-20-Oz-Copper-PCB

Surface Finish Of 20 oz Copper PCB

Copper must be protected from oxidation by a Oberflächenbeschaffenheit der Leiterplatte of 20 oz copper to meet a high level of application performance. Reliable connections between printed circuit boards and electrical components require a smooth surface finish.

Venture’s PCB surface finish capability includes HASL, HASL LF, ENIG, Immersion Silver, Immersion Tin, OSP. But only surface finishes like HASL and ENIG are used on 20oz copper PCBs to ensure maximum performance.

Wie viele Schichten kann eine 20-Unzen-Kupferplatine haben?

Multilayer printed circuit boards are often used in a variety of devices because of their flexibility. Multiple circuits and routing can be accommodated on a board with more layers to handle more complex applications. For example, since cell phones are very complex gadgets, printed circuit boards may include as many as 12 layers.

A 20 oz copper PCB could contain anything from 1 layer to 30 layers. These layers are responsible for ensuring that they operate at peak performance. The more layers, the higher its performance.

If you want to know more information, feel free to contact our Venture team.

How-Many-Layers-Can-20-Oz-Copper-PCB-Have

Ihr bester 20-Unzen-Kupfer-PCB-Partner

20 Unzen Kupferplatine

20 Unzen Kupferplatine

Venture, we pride ourselves on our excellent customer service and reliability.  Venture also offers exclusive services to help our customers with their PCB Projects.We want to make your life easier with our printed circuit board manufacturing and assembly capability. Our service design includes:

  • 20 oz copper PCB double sided copper design
  • Quantum Board PCB design
  • Heavy copper based PCB design
  • Multi-layer heavy copper PCB design
  • Fr4 Copper clad laminate PCB design

Ihr führender 20-Unzen-Kupfer-PCB-Lieferant in China

20 Unzen Kupferplatine

20 oz copper PCB is not a new innovation, as it has been used for a long time in PCBs that can withstand the exacting requirements of military and defense applications, such as in weapons controls. Mainstream electronics makers increasingly require ways to transfer heat away from components, and 20 oz copper PCB is becoming more prevalent in an growing number of non-military uses.

20 0z

Venture verfügt über umfangreiche Erfahrung und Technologieverständnis, mit eigenen Produktionskapazitäten und zentralisierten Ressourcen vor Ort. Wir sind in der Lage, Ihnen einen One-Stop-Service mit kleiner, mittlerer und Massenproduktion zu wettbewerbsfähigen Bedingungen, Qualität und Liefersicherheit anzubieten, die alle Ihre Anforderungen anpassen.

20 0z

Venture have a professional and well‐experienced technical team to support you value added service of PCBA SMT and BOM sourcing .We can support for small‐medium‐mass production flexibly with fast response and professional service. We have reached at level of expertise by achieving many milestones in CAD design, Circuit Design, Printed Circuit Board (PCB) Design and production services.

20 0z

Our extensive PCB product portfolio offers from conventional FR4, Aluminium PCB, FPC, Rigid‐Flex PCB, heavy copper, long board, thin board and other exotic PCBs in standard delivery time and quick‐turn service.

Our modern factories equipped with latest high end precision machines are capable of design the PCBs as per the customer’s requirements. We are supplying our products to various industries like Automotive, Electronics, Industrial control systems etc. We are open to manufacture PCBs as per the customer’s design and quality need.

20 Unzen Kupfer PCB: Der ultimative FAQ-Leitfaden

20-Oz-Copper-PCB-The-Ultimate-FAQ-Guide

Today’s guide covers all concepts you would like to know about 20 Oz copper PCB.

It covers quality standards, design, application, configuration and testing process, just to mention a few.

So, if you want to be an expert in 20 oz copper PCB, read this guide.

Was ist eine 20-Unzen-Kupferplatine?

A 20 oz copper PCB is an extreme heavy copper printed circuit board with a thickness of 28 mils/ 0.028 inches/ 711.2 µm.

Extreme heavy copper PCBs are defined as those equal to or exceeding 20 oz in copper weight. A 20 oz copper PCB utilizes copper fixtures amounting to 20 oz/ft2.

20 Unzen PCB

20 Unzen PCB

Where is 20 Oz Copper PCBs Applied?

The 20 oz copper PCB finds use in applications requiring large current transmissions.

You find that most of these applications require high levels of performance and reliability.

More thermal energy will be dissipated in such applications requiring efficient management structure.

Some applications of the 20 oz copper PCB includes:

  • Military and space applications with very extreme temperature conditions
  • High-intensity welding equipment
  • Distribution of solar energy for large scale production such as solar fields
  • High power converters
  • Power-based engineering systems such as control systems
  • Planar based transformer
  • Equipment with demands for large heat dissipation

What are the Common Configurations of 20 Oz Copper PCB?

You will commonly find 20 oz copper PCBs in double-sided board formation and mehrschichtig Formation.

A common feature of the 20 oz copper PCB is the thick copper formation.

A double-sided 20 oz copper PCB features a formation where copper surfaces are attached on both board sides.

This formation allows the attachment of components on both sides of the board increasing board density.

Additionally, you find the double-sided board design allows the use of wider traces and increased spacing between traces.

Trace width and spacing are influential in the Wärmemanagement process for the 20 oz copper PCB.

Multi-layer boards are composed of several layers bonded together.

The layer count for such boards can exceed twenty with copper foils of at least 1 oz/ft2 verwendet werden.

For 20 oz copper, PCBs multi-layers allow increased density and miniaturization efforts.

You find the number of multi-layers is also influenced by the intended application and operating frequency.

Additionally, the required number of signal layers will influence the layer count.

How can a 20 Oz Copper PCB Fail?

A 20 oz copper PCB can fail through a variety of ways.

You find shortcomings in the design for components as a major cause of board failure.  Such shortcomings can be manifested through:

20 Unze Kupferplatine

20 Unzen Kupferplatine

  • Poorly placing components
  • Making poor electrical connections for components
  • Use of inadequate spacing between components that could result in overheating
  • Burning of components on the board through overheating
  • Weak attachment of components on the board by soldering
  • Leakage of chemical fluids contained in some components
  • Use of defective material for components

What are the Temperature-related Aspects for 20 Oz Copper PCB Materials?

Some of the main temperature aspects related to these dickes Kupfer PCB -System umfasst:

·       The Temperature of Glass Transition

Das Glasübergangstemperatur refers to the temperature at which materials stop exhibiting glass properties.

In this temperature range, the forces holding the molecules together begin to wear off resulting in a viscous formation.

Materials used in 20 oz copper PCB fabrication need a high glass transition temperature.

There is large thermal dissipation in 20 oz copper PCBs.

When materials with low glass transition are used, they’d easily alter their structural formation resulting in board failure.

·       Wärmeausdehnung

When a material is subjected to temperature variants, it responds by expanding or contracting. Thermal expansion is used to monitor the material response in expansion when temperature values are increased.

The expansion rate can be determined for every degree to change to give the parameter Wärmeausdehnungskoeffizient (CTE).

A low CTE is desired for materials used for 20 oz copper PCB to prevent material manipulation during temperature rises.

·       Wärmeleitfähigkeit

With the 20 oz copper PCB, thermal dissipation is a major issue.

Due to the large currents conducted, there is a need to have a thermal strategy to prevent temperature build-up.

The materials used for the 20 oz copper PCB need to have good thermal conductivity.

Multi-layer boards will have to conduct the heat away to the bottom for external elimination. Materials with good thermal conductivity property will ensure the faster transfer of heat ensuring timely dissipation.

How can Environmental Factors Pose a Problem to 20 Oz Copper PCBs?

20 Unze Kupferleiterplatte

20 Oz printed circuit board

20 oz copper PCBs are meant to withstand extreme conditions such as temperature and humidly.

However, sustained exposure without mitigating e4fforts can pose a danger to the board functionality.

Continuous temperature rise without thermal management can build to thermal stress on the board.

Thermal strain can result in overheating of the board surface and assembly resulting in malfunctions.

Furthermore, increased water molecule presence on the board surface can affect its performance.

Moisture content can result in electrical shorts. Fanning the board surface and providing ambient temperatures can diminish moisture presence.

What Metrics are Considered for Materials used in 20 Oz Copper PCB?

Due to the application demands for the 20 oz copper PCB, the material characteristics are important.

The materials used should withstand the harsh conditions expected during application.

Some pivotal material aspects include:

·       Schiere Stärke

An allied force that fails the plane of action parallel is referred to as a shear force.

Materials in 20 oz copper PCBs should have high shear strength.

Such materials should not easily yield under a point force.

The shear strength of a material is especially useful to a multi-layer board configuration.

When these materials are banded together in the inner layer core, they provide mechanical support to the board construction.

·       Feuchtigkeitsaufnahme

Moisture content is undesired in materials used for 20 oz copper PCB.

Materials with a high absorption rate will influence dielectric properties and lower tracking resistance.

Furthermore, you find materials with high absorption rates make the board assembly heavier.

Moisture presence can be controlled on the board.

However, using materials with low absorption rates is better.

Material compounds with fibreglass, epoxy and teflon have low rates of moisture absorption.

·       Zugfestigkeit

When a material is subjected to stretching forces, a point is reached where the material succumbs to the applied forces.

The value at which a breakdown occurs signifies its tensile strength.

The material can either break or stretch under such forces.

Materials used in the 20 oz copper PCB should bear such force application, maintaining its material structure.

Good tensile strength property allows materials to tolerate impact and rough handling.

·       Dielektrizitätskonstante and Breakdown

Dielectric properties of a material describe the responsiveness to external exposure to an electrical field.

The dielectric constant speaks to the permittivity of a material.

A material with low dielectric constant offers stable charge conditions.

Materials used in 20 oz copper PCB require low values to dissuade electric charge transfer when leakage occurs.

Additionally, exposure to the large current condition in the 20 oz copper PCB will not affect materials with low values.

Sometimes materials can have their molecular forces overcome allowing the movement of charge.

When this occurs, the material is said to undergo a dielectric breakdown. Breakdown occurs on a voltage application.

·       Resistance to Tracking

Tracking occurs when the charge leakage in material causes the neighbouring materials to conduct charge transfer.

Copper films in multi-layer board constructions are attached to fibreglass laminates.

These laminates have low electrical conductivity.

Low resistance to tracking can result in these materials conducting undesired electron flow. Materials used in 20 oz copper PCB need to have high tracking resistance to maintain their functional aspects.

·       Machinability and Flame Resistance

Machinability is a material property that allows for easy workability.

When materials have increased machinability, they adhere to the fabrication processes more easily.  You thus find that they can be made into the desired form.

Flame resistant materials do not burn up easily.

When the temperature values rise, inflammation can be experienced in non-flame retardant material.

When that happens, it negatively affects the structural integrity of the board.

How can you Test a 20 Oz Copper PCB?

A 20 oz copper PCB can be tested by using Automated X-Ray inspection.

This test procedure involves the use of X-rays to carry out a board inspection.

It is especially useful when faced with multilayer board construction as it can inspect parts out of natural sight.

The automated x-ray inspection helps optimize latter processes such as assembly and identifying anomalies.

To perform checks on the 20 oz copper PCB, it is used alongside computer software to aid in recognizing patterns.

These programs also process images.

In automated x-ray inspection, x-rays are cast to the board surface recording internal images of the board construct.

Computer software processes the image to the level of identifying physical characteristics of the captured object(s).

The features of the object(s) are then compared to the original design and anomalies, if any, identified.

Magnification of images is also possible allowing even the most intricate details to be captured and examined.

What Process Controls are used when making the Inner Layer Core for 20 Oz Copper PCB?

20 Oz copper printed circuit board

20 Oz printed circuit board

The inner layer core is formed from a combination of glass fibre or epoxy material with resin reinforcement.

The process of making the inner layer core is important in determining overall board strength.

To ensure the effective fabrication of the inner core, the following controls are taken:

  • Resin is used alongside other chemical elements to develop desired properties.

The composition of these chemical elements has to be monitored to prevent excesses and inefficiencies.

  • The viscosity of the resin has to be within set standards. A resin product with a viscosity of the accepted range can jeopardize the whole process.
  • When the woven cloth of fibreglass or epoxy is treated, it is stretched to provide a flat surface for resin application.

The stretching forces need to be controlled to prevent overstretching that could break the knitting.

Furthermore, under-stretching could result in the formation of wrinkles.

  • There should be no contamination of the resin or cloth surface with foreign matter during the application process.

As such, the environment should be kept clean free of dust and other intrusive particles.

  • The amount of resin applied over the glass should also be within set limits. The woven cloth of material should not have excess or inadequate resin applied.
  • To what extent the heating procedure is carried out in the curing process is a pivotal factor.

Care has to be taken to ensure the curing is not done for longer than is expected. Neither should the process be shorter than expected.

  • The resulting binding material should be stored in an environment where the temperature and moisture levels are controlled.

Temperature levels can affect the curing condition, while moisture affects the structural formation of the material.

Which Electronic Component Types are Supported on the 20 Oz Copper PCB?

Beide Aufputz elektronische Bauteile und Durchgangslochkomponenten can be affixed to the 20 oz copper PCB.

While miniaturization has seen many electronic components made as surface mounts, others are still leaded for attachment.

Surface-mounted components are typically small and without leads.

Their attachment points are positioned at their base or along their edges.

Surface-mounted components require soldering to be connected to the board surface.

Through-hole components have leads which are wire-like extensions on their body surfaces. The leads can be axial or radial.

Axial leads are centrally positioned as straight extensions on component sides.

Radial leads are positioned on the bottom surface of a component.

The connecting points of leads on the 20 oz copper PCB are drilled holes. These holes are connected to the conductive path of the board.

Through-hole components do not require soldering and are easily removed and replaced.

Leiterplattenkomponenten

Leiterplattenkomponenten

How much Current can a 20 Oz Copper PCB Carry?

The 20 oz copper PCB as an extreme copper PCB can carry large amounts of current.

You can determine the current-carrying ability of your 20 oz copper PCB by using the trace width and thickness.

You find that to conduct larger currents, you can increase the trace width.

When you increase the trace width, the cross-sectional area for the copper trace is also increased.

As a result, there is more area for the current movement.

However, larger trace widths require more spacing requirements. Copper traces dissipate heat which is conducted over the board surface to heat vias.

Inadequate spacing can result in tracking that could result in thermal strain.

What Single Packaging Types are used for 20 Oz Copper PCB?

Individual electronic components assembled on the board have various packaging designs.

The 20 oz copper PCB can accommodate chips with the following packages:

  • Dual-in-Line-Paket
  • Leadless Ceramic Chip Carriers
  • Plastic Quad Flat Package
  • Pin-Grid-Array

Besides, the dual inline package encompasses a ceramic or plastic body.

Also, the pins are arranged along the two long edges providing board connection.

The leadless ceramic chip carrier has no extending leads and is made from ceramic material.

You find the leadless ceramic chip carrier has metallized contacts attached to the bottom surface.

These contacts are arranged around the component providing an electrical path for board connection.

The plastic quad flat package is characterized by a low pin profile around the edges of the plastic package.

Besides, the pin grid array consists of pin-like projections on the bottom surface which attach to the board.

Is Wafer-level Packaging used on the 20 Oz Copper PCB?

Ja.

Wafer-level packaging consists of a chip and package combination made as the wafer is developed.

This packaging type is smaller than the typical surface mount chips.

You find the following reasons for using the wafer-level packaging on a 20 oz copper PCB.

  • This packaging is very small allowing increased density per square inch.
  • The contacts for electrical connection are short augmenting their performance.
  • Since the input and out pins are attached while making the chip and not separately furnished, the cost is greatly reduced.
  • Performing an electrical test on the chip is less complex and simple.
  • The wafer-level package does not require underfilling with organic-based materials

What Cooling Techniques are used for the 20 Oz Copper PCB?

1 Layer 20 Oz PCB

 1 Layer 20 Oz PCB

Cooling is a necessary measure for a 20 oz copper PCB due to the high thermal dissipation.

High temperatures can lead to overheating of the board assembly leading to thermal strain. Additionally, electronic components can overheat and burn-up.

Cooling methods on a 20 oz copper PCB ensures effective removal of excess heat from the board.

A common method of eliminating excess thermal energy is by using a heat sink.

A heat sink releases heat to the external environment by convection.

Discriminate areas on the 20 oz copper PCB can be heavily plated with copper to function as heat sinks.

The areas can be connected with heat vias for multilayer construction to ensure cooling measures are taken on each surface.

Also, the base material can also be fabricated with a copper plate to act as a heat sink.

Besides, the base plate can also be connected to an external sink or attached to a cold plate. Heat is conducted to the bottom layer through vias before being disseminated by convection.

How is the Prepreg Prepared for 20 Oz Copper PCB?

Prepreg is used to make the bonding sheets for the lamination process of a multilayer 20 oz copper PCB.

To make prepreg, a material reinforcement is first smeared with resin.

A common reinforcement material used is a cloth of woven fibreglass.

The resin coating process is carried out by rolling the cloth through treaters in a treatment process.

Here, the fibreglass is swiped in a resin dip, with a leveller spreading the resin over and into the cloth.

The thickness of the resin is also determined by the leveller.

After the treatment process is the heating process.

The now resin-coated fibreglass is subjected to different heat conditions implemented through radiated heating or forced hot air or both.

In these heating processes, the solvent base for the resin is evaporated first.

Subsequent heat processes are meant to set the resin in curing processes.

Formation of continuous prepreg material is achieved through this process.

The material can be rolled or cut to size in pieces.

What are the Limitations for using Lead-free Assembly for 20 Oz Copper PCB Base Material?

The base materials of a 20 oz copper PCB are a combination of resins and reinforcements alongside a conductor.

The physical electrical and mechanical properties of the base material are determined by the material composition.

Assembling base material typically uses lead-based compounds in the assembly process. However, the restrictive use of lead has led to the subscription of alternative processes.

These processes have the following limitations:

  • You find that without lead, the resin can begin to transit when maximum assembly temperatures are achieved.
  • Furthermore, the rate of expansion of the materials induced by thermal changes increases. The result is an exertion of thermal stress.
  • The peak temperatures in the assembly process without lead elements causes moisture in the materials to exert pressure. The result is a surface contusion.
  • Replacement elements for lead have less desirable electrical properties.

What Surface Treatments are used on the Copper Foil in 20 Oz Copper PCB?

You find the copper film used in the 20 oz copper PCB is usually formed through electro-deposition.

Electro-deposition affects the surface profile which can be tinkered with top support different desired applications.

The following surface treatments are typically used:

Schweres Kupfer PCB

Schweres Kupfer PCB

·       Bonding Treatment

With this treatment, the copper film’s useful area is increased through the addition of plated copper balls on the surface.

Consequently, attaching the foil to a resin results in a stronger bond formation.

·       Wärmebarriere

This treatment is carried out after bonding.

The copper nodules on the film surface are coated with brass, or sometimes zinc or nickel.

Besides, the layer offers protection from thermal and chemical-induced damage as a result of subsequent assembly processes.

·       Coatings for Passivation and Anti-oxidation

When a copper film is subjected to this treatment, it is usually done on both sides.

The coating prevents the oxidation of the film when laminated or stored.

You can easily remove this coating by chemical cleaning.

How are Leakage Current and Voltages Controlled on 20 Oz Copper PCBs?

Leakage current and voltages on the 20 oz copper PCB can occur due to a variety of reasons. Leakage can occur because of deficiencies in resistance to insulation within the base components.

The presence of foreign matter during the fabrication process can also cause leakage.

To control leakages on the 20 oz copper PCB, the major strategy is to create a protective enclosure.

The enclosure is used for critical surface components on the board and conductive paths.

Voltages that are unguarded are thereafter isolated from the enclosures with a connection to a voltage source with low impedance provided.

What is Multilayer Lamination in 20 Oz Copper PCB?

Mehrschichtige Leiterplatte

Mehrschichtige Leiterplatte

Multi-layer lamination is a process where several layers of copper foil and prepreg are combined under heat and pressure.

Multi-layer lamination is used in the making of 20 oz copper PCB with multilayer formation.

In multilayer lamination, the lamination stack is subjected to a vacuum treatment before being baked and cured.

Placing the stack in a vacuum helps in eliminating moisture and solvent traces form the previous processes.

The lamination process is then carried out in a pressure chamber with elevated temperatures to stir the curing process.

Besides, the resin content determines the duration and temperature of curing.

Pressure helps in holding the stack together as the resin sets.

The pressure is influenced by the material composition of the multilayer stack.

Furthermore, the extent of the vacuum process affects the pressure procedure.

Pressure levels are reduced when resin flow subsides.

Following the pressurized heating process, the multilayer stack is allowed to cool.

The cooling process is not hastened to ensure the reduced occurrence of deformities associated with fast cooling such as warpage.

Are 20 Oz Copper PCB Laminates Tested?

Before laminates are used for 20 oz copper PCB, they undergo tests to determine whether they meet the design requirements.

The major tests carried out are mechanical, electrical and thermo-mechanical.

The mechanical test seeks to determine the tensile strength of the laminate alongside its flexural ability.

Additionally, a test to determine how much strength is expected when combined with a copper film is carried out.

Thermo-mechanical tests seek to establish the standing of the laminates material strength when subjected to thermal changes.

The major aspects evaluated in this process include the glass transition temperature, the thermal resistance and the CTE.

You also find the resistance of the laminate to solder application established.

Electrical tests attempt to highlight the laminate’s properties concerning its dielectric constant and dissipation factor.

Furthermore, its surface resistivity, the value of dielectric breakdown voltage and volume resistivity are also established.

What are the Drilling Aspects for 20 Oz Copper PCB?

Drilling is important in 20 oz copper PCB fabrication to form holes for component attachment and plated through-holes for multilayer connectivity.

Drilling equipment controlled manually or electrically are used in the drilling process.

When drilling, the following aspects are important:

  • Hole parameters such as diameter and depth
  • Number of required hits allowed for a single hole
  • Speed of the drilling process
  • Rates of retraction and in-feeding
  • Height of the laminated stack
  • Level of vacuuming done
  • Material types used in the stack

Was sind die Qualitätsstandards für 20-Unzen-Kupfer-Leiterplatten?

Some standards guiding the fabrication and assembly of the 20 oz copper PCB includes:

·       ASTM-F1896

This standard provides a testing methodology for establishing the electrical resistivity of the conductor trace on a 20 oz copper PCB.

·       BS-6221-24

With this standard, a guide is provided for creating artwork for printed circuit boards including the 20 oz copper PCB.

·       BS-CECC-23200-801

A harmonized approach for assessing electronic components is provided in this standard. Specifications are provided especially for single and double-sided boars with conductive vias.

·       BS-EN-62878-1-1

This standard establishes the guidelines for substrates embedded in multilayer board formations.

·       PD-IEC-61191-7

This standard elaborates on the assembly process for printed boards such as the 20 oz copper PCB.

With this information, you can definitely choose a high quality 20 oz copper PCB.

At Venture, we design and fabricate PCBs, for a range of applications.

Kontaktieren Sie uns for custom solutions on printed circuit boards.

 

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